Diamond Wafer

RFHIC의 다결정(Polycrystalline) CVD 다이아몬드 히트 스프레더는
높은 열전도율과 전기 절연 특성을 제공하여 AI 반도체, GaN RF, SiC 전력 모듈,
레이저 다이오드의 열관리에 적합합니다.

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Part Number	Datasheet	Size	Edges	Edge Features	Lateral Tolerance	Form	Growth Method	Structure	Thermal Conductivity	Thickness	Surface Roughness (Ra)	Electrical Property	Grade
DiaFlux™ 150		Ø3–100 mm (round) / 3×3–70×70 mm (square)	Laser cut	<0.2 mm	±0.2 mm	Custom Plate, Chip, Heat Spreader, Wafer	Plasma Chemical Vapor Deposition	Cubic, Polycrystalline	1,500 W/m·K (at 25 ℃)	200 / 350 / 500 µm (±20 µm)	<20 nm	Electrically Insulating	Standard Thermal Grade
DiaFlux™ 180		Ø3–100 mm (round) / 3×3–70×70 mm (square)	Laser cut	<0.2 mm	±0.2 mm	Custom Plate, Chip, Heat Spreader, Wafer	Plasma Chemical Vapor Deposition	Cubic, Polycrystalline	1,800 W/m·K (at 25 °C)	200 / 350 / 500 µm (±20 µm)	<20 nm	Electrically Insulating	High Performance Thermal Grade